In most case plasma treatment do not require the use of toxic substance. The plasma gases used are usually air, Nitrogen or Argon. A few percent of reactive gases such as H₂ or O₂ is sometimes added. In the case of plasma polymerization a precursor molecule is added to the plasma gas. Specific care must be taken depending on the precursor molecule used.

Plasma processes takes place at room temperature.   Therefore energy is not wasted by using heating or cooling systems. The low temperature of the plasma phase also allows the treatment of temperature sensitive substrate.

Plasma processes are dry, they do not require the use of solvent. There is therefore no need to treat large quantity of contaminated liquid waste.

As the process takes place at atmospheric pressure, there is no need to use sealed vacuum chamber. The process can take place in an open reactor, allowing for continuous process instead of batch operation. This strongly decrease the treatment cost per item.

Plasma treatment of materials only affect the uppermost layer of the products.  This allows one to modify the surface properties of a material while keeping its bulk properties.

Thanks to the very high reactivity of the cold atmospheric plasma a wide range of molecules can be deposited on most substrates.  

Those coatings can add new properties such as: anti-fogg, anti-scratch, bactericide and many more.

Cold atmospheric pressure plasma are an innovative process than can replace existing technologies but also allow to create completely new chemistries.

This solvent free, low energy process is able to replace conventional wet chemistry process, that might be rendered obsolete by though new environmental law such as REACH.